PCB Techinecal CapacityLayersMass production: 2~58 layers / Pilot run: 64 layersMax. ThicknessMass production: 394mil (10mm) / Pilot run: 17.5mmMaterialFR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead
PCB Techinecal Capacity
Layers | Mass production: 2~58 layers / Pilot run: 64 layers |
Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm |
Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) |
Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ |
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
Max. Panel Size | 1150mm × 560mm |
Aspect Ratio | 18:1 |
Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
