Professional PCB Factory Electronic Circuit Board PCB Board

PCB Techinecal Capacity LayersMass production: 2~58 layers / Pilot run: 64 layersMax. ThicknessMass production: 394mil (10mm) / Pilot run: 17.5mmMaterialFR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead

  • Model: Professional PCB Factory Electronic Circuit Board PCB Board

PCB Techinecal Capacity

 

Layers

Mass production: 2~58 layers / Pilot run: 64 layers

Max. Thickness

Mass production: 394mil (10mm) / Pilot run: 17.5mm

Material

FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.

Min. Width/Spacing

Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)

Max. Copper Thickness

UL certificated: 6.0 OZ / Pilot run: 12OZ

Min. Hole Size

Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)

Max. Panel Size

1150mm × 560mm

Aspect Ratio

18:1

Surface Finish

HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

Special Process

Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.


PCBA technical Capacity

SMT

Position accuracy:20 um

Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP

Max. component height::25mm

Max. PCB size:680×500mm

Min. PCB size:no limited

PCB thickness:0.3 to 6mm

PCB weight:3KG

Wave-Solder

Max. PCB width:450mm

Min. PCB width: no limited

Component height:Top 120mm/Bot 15mm

Sweat-Solder

 Metal type :part, whole, inlay, sidestep

 Metal material:Copper , Aluminum

 Surface Finish:plating Au, plating sliver , plating Sn

 Air bladder rate:less than20%

 Press-fit

 Press range:0-50KN

 Max. PCB size:800X600mm

 Testing

 ICT,Probe flying,burn-in,function test,temperature cycling